Invention Application
- Patent Title: Highly-Reliable Micro-Electromechanical System Temperature Sensor
- Patent Title (中): 高度可靠的微机电系统温度传感器
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Application No.: US13747433Application Date: 2013-01-22
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Publication No.: US20130202012A1Publication Date: 2013-08-08
- Inventor: Dimitrios Peroulis , Andrew S. Kovacs , David Joseph Koester , Farshid Sadeghi , Sean M. Scott , Douglas Edward Adams
- Applicant: Purdue Research Foundation
- Applicant Address: US IN West Lafayette
- Assignee: PURDUE RESEARCH FOUNDATION
- Current Assignee: PURDUE RESEARCH FOUNDATION
- Current Assignee Address: US IN West Lafayette
- Main IPC: G01K7/34
- IPC: G01K7/34

Abstract:
A micro-electromechanical system-type (MEMS) sensor arrangement for wirelessly measuring temperatures is disclosed. The MEMS sensor arrangement includes a multimorph sensor, a sensor coil coupled to the multimorph sensor, and a readout coil configured to be magnetically coupled to the sensor coil to i) energize the sensor coil, and ii) provide a readout of the natural frequency of the multimorph sensor, the sensor coil and the readout coil.
Public/Granted literature
- US09039280B2 Highly-reliable micro-electromechanical system temperature sensor Public/Granted day:2015-05-26
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