发明申请
- 专利标题： PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE RESIN COMPOSITION OR PHOTOSENSITIVE RESIN COMPOSITION FILM
- 专利标题（中）： 感光性树脂组合物，感光性树脂组合物膜和使用感光树脂组合物或光敏树脂组合物膜的半导体器件
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申请号： US13807210申请日： 2011-06-10
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公开(公告)号： US20130214379A1公开(公告)日： 2013-08-22
- 发明人: Hiroyuki Niwa
- 申请人： Hiroyuki Niwa
- 申请人地址： JP Tokyo
- 专利权人： Toray Industries, Inc.
- 当前专利权人： Toray Industries, Inc.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-151596 20100702
- 国际申请： PCT/JP2011/063339 WO 20110610
- 主分类号： G03F7/023
- IPC分类号： G03F7/023 ; H01L23/00 ; H01L23/29
摘要：
A photosensitive resin composition contains: (a) an alkali-soluble polyimide; (b) a compound which has two or more epoxy groups and/or oxetanyl groups in each molecule; and (c) a quinonediazide compound. Less than 10 parts by weight of an acrylic resin is contained per 100 parts by weight of the polyimide (a); and the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a).
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