发明申请
US20130221455A1 Methods for Embedding Controlled-Cavity MEMS Package in Integration Board
有权
在集成板中嵌入可控腔MEMS封装的方法
- 专利标题： Methods for Embedding Controlled-Cavity MEMS Package in Integration Board
- 专利标题（中）： 在集成板中嵌入可控腔MEMS封装的方法
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申请号： US13405513申请日： 2012-02-27
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公开(公告)号： US20130221455A1公开(公告)日： 2013-08-29
- 发明人: Christopher D. Manack , Frank Stepniak , Sreenivasan K. Koduri
- 申请人： Christopher D. Manack , Frank Stepniak , Sreenivasan K. Koduri
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L29/66 ; H01L21/02 ; H01L31/02
摘要：
An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
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