Invention Application
- Patent Title: SEMICONDUCTOR DEVICES INCLUDING DUMMY SOLDER BUMPS
- Patent Title (中): 半导体器件包括DUMMY SOLDER BUMPS
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Application No.: US13753774Application Date: 2013-01-30
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Publication No.: US20130221519A1Publication Date: 2013-08-29
- Inventor: Son-kwan Hwang , Byung-Iyul Park , Hyun-soo Chung , Jin-ho Chun , Gil-heyun Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0018652 20120223
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
A semiconductor device includes a substrate on which integrated circuit units are formed, main solder bumps that are electrically connected to the integrated circuit units on the substrate and dummy solder bumps that are not electrically connected to the integrated circuit units on the substrate. The dummy solder bumps are narrower than wiring patterns immediately below the dummy solder bumps.
Information query
IPC分类:
