发明申请
- 专利标题: Two-Shaft Drive Mechanism and Die Bonder
- 专利标题(中): 双轴驱动机构和模具粘合机
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申请号: US13587101申请日: 2012-08-16
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公开(公告)号: US20130221764A1公开(公告)日: 2013-08-29
- 发明人: Yoshihide ISHII , Masayuki MOCHIZUKI , Yoshihiro KURIHARA
- 申请人: Yoshihide ISHII , Masayuki MOCHIZUKI , Yoshihiro KURIHARA
- 申请人地址: JP Kumagaya-shi
- 专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人地址: JP Kumagaya-shi
- 优先权: JP2012-042896 20120229
- 主分类号: H02K41/02
- IPC分类号: H02K41/02
摘要:
A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.
公开/授权文献
- US09324679B2 Two-shaft drive mechanism and die bonder 公开/授权日:2016-04-26
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