Two-Shaft Drive Mechanism and Die Bonder
    1.
    发明申请
    Two-Shaft Drive Mechanism and Die Bonder 有权
    双轴驱动机构和模具粘合机

    公开(公告)号:US20130221764A1

    公开(公告)日:2013-08-29

    申请号:US13587101

    申请日:2012-08-16

    IPC分类号: H02K41/02

    CPC分类号: H01L24/75 H01L2224/75702

    摘要: A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.

    摘要翻译: 双轴驱动机构包括处理单元,设置有第一可动部的第一线性马达和第一固定部,第一线性马达沿着第一线性引导件升高处理单元,第二线性马达设置有第二可动部, 第二固定部分,其沿垂直于用于升高处理单元的方向的水平方向移动处理单元;固定第一固定部分的支撑体;设置在支撑体和第二固定部分之间的第二线性引导件 并且允许第二固定部分自由移动;以及控制单元,其基于线性传感器的输出控制第一可移动部分在水平方向上的位置,该线性传感器的输出检测第一可移动部分在水平方向上的位置, 尊重支持机构。