发明申请
- 专利标题： MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE AGENT COMPOSITION
- 专利标题（中）： 水分可固化反应热熔胶粘剂组合物
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申请号： US13822254申请日： 2011-09-05
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公开(公告)号： US20130225745A1公开(公告)日： 2013-08-29
- 发明人: Toyohisa Fujimoto , Nobuyoshi Maizuru
- 申请人： Toyohisa Fujimoto , Nobuyoshi Maizuru
- 申请人地址： JP Osaka-shi, Osaka
- 专利权人： KANEKA CORPORATION
- 当前专利权人： KANEKA CORPORATION
- 当前专利权人地址： JP Osaka-shi, Osaka
- 优先权： JP2010-202341 20100909
- 国际申请： PCT/JP2011/070097 WO 20110905
- 主分类号： C09J133/14
- IPC分类号： C09J133/14
摘要：
The present invention aims to provide a moisture-curable reactive hot-melt adhesive composition which contains no vinyl chloride resin, which is excellent in adhesion to oily steel sheets and electroplated steel sheets, which has high strength immediately after application to effectively improve the production cycle, and which can be suitably used in vehicle applications. This challenge is solved by a moisture-curable reactive hot-melt adhesive that includes an oxyalkylene polymer containing a reactive silyl group, an alkyl (meth)acrylate (co)polymer, a tackifying resin, and a specific inorganic filler in combination.