Invention Application
US20130233605A1 SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
有权
固体电解电容器和具有该电容器的电路板
- Patent Title: SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
- Patent Title (中): 固体电解电容器和具有该电容器的电路板
-
Application No.: US13607820Application Date: 2012-09-10
-
Publication No.: US20130233605A1Publication Date: 2013-09-12
- Inventor: Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
- Applicant: Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW101108286 20120312
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.
Public/Granted literature
- US09030808B2 Solid electrolytic capacitor and circuit board having the same Public/Granted day:2015-05-12
Information query