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公开(公告)号：US09030808B2
公开(公告)日：2015-05-12
申请号：US13607820
申请日：2012-09-10
Applicant: Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
Inventor： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
CPC classification number: H05K1/162 , H01G9/012 , H01G9/04 , H01G9/15 , H01G9/26 , H05K1/0231 , H05K1/053 , H05K2201/0116 , H05K2201/0175 , H05K2201/0191 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/09063 , H05K2201/10522 , H05K2203/0307 , H05K2203/0315 , H05K2203/0369 , H05K2203/0723
Abstract: A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.
Abstract translation: 提供电容器和具有该电容器的电路板。 电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。 基板包括第一电极和多孔结构。 至少两个分布区域中的多孔结构具有不同的深度。 氧化物层设置在多孔结构的表面上。 第二电极设置在氧化物层上并且包括导电聚合物材料。 设置在第二电极上的绝缘层具有第三和第四表面。 绝缘层的第四表面与第二电极连接。 导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。
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公开(公告)号：US20120168217A1
公开(公告)日：2012-07-05
申请号：US13197283
申请日：2011-08-03
Applicant: Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
Inventor： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
IPC: H05K1/16
CPC classification number: H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
Abstract: An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
Abstract translation: 嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。 在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。 嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。 金属基板用作第一电极，并且基板用作第二电极。 在基板和金属基板之间形成绝缘材料。 因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且还可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。
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公开(公告)号：US08941015B2
公开(公告)日：2015-01-27
申请号：US13197283
申请日：2011-08-03
Applicant: Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
Inventor： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
CPC classification number: H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
Abstract: An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
Abstract translation: 嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。 在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。 嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。 金属基板用作第一电极，并且基板用作第二电极。 在基板和金属基板之间形成绝缘材料。 因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。
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公开(公告)号：US20130233605A1
公开(公告)日：2013-09-12
申请号：US13607820
申请日：2012-09-10
Applicant: Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
Inventor： Chien-Min Hsu , Min-Lin Lee , Li-Duan Tsai
IPC: H05K1/18
CPC classification number: H05K1/162 , H01G9/012 , H01G9/04 , H01G9/15 , H01G9/26 , H05K1/0231 , H05K1/053 , H05K2201/0116 , H05K2201/0175 , H05K2201/0191 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/09063 , H05K2201/10522 , H05K2203/0307 , H05K2203/0315 , H05K2203/0369 , H05K2203/0723
Abstract: A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.
Abstract translation: 提供电容器和具有该电容器的电路板。 电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。 基板包括第一电极和多孔结构。 至少两个分布区域中的多孔结构具有不同的深度。 氧化物层设置在多孔结构的表面上。 第二电极设置在氧化物层上并且包括导电聚合物材料。 设置在第二电极上的绝缘层具有第三和第四表面。 绝缘层的第四表面与第二电极连接。 导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。
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公开(公告)号：US20110157775A1
公开(公告)日：2011-06-30
申请号：US12776442
申请日：2010-05-10
Applicant: Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
Inventor： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
IPC: H01G9/00
Abstract: A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.
Abstract translation: 解耦装置包括引线框架，电容器单元，金属层和高介电有机 - 无机复合材料层。 引线框架包括阴极端子部分和阳极端子部分。 电容器单元设置在引线框架上。 电容器单元包括阴极部分，阳极部分和位于阴极部分和阳极部分之间的绝缘部分。 阴极部分电连接到阴极端子部分，并且阳极部分电连接到阳极端子部分。 高介电有机 - 无机复合材料层通过金属层并联连接到电容器单元。
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Patent Agency Ranking
公开(公告)号：US07894178B2
公开(公告)日：2011-02-22
申请号：US12046422
申请日：2008-03-11
Applicant: Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
Inventor： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
CPC classification number: H05K1/162 , H01G9/012 , H01G11/48 , H05K2201/09809 , H05K2203/0315 , Y02E60/13 , Y10T29/417 , Y10T29/435
Abstract: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.
Abstract translation: 提供至少包括基板，阳极层，电介质层，第一阴极层和第二阴极层的通孔电容器。 基板具有多个通孔。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 电介质层设置在阳极层的多孔结构上。 第一阴极层覆盖电介质层的表面。 第二阴极层覆盖第一阴极层的表面，第二阴极层的导电性大于第一阴极层的导电率。 通孔电容器可用于阻抗控制，因为通孔的阴极层用于信号传输。
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公开(公告)号：US07561410B1
公开(公告)日：2009-07-14
申请号：US12050188
申请日：2008-03-18
Applicant: Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
Inventor： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
IPC: H01G9/025
CPC classification number: H01G9/15 , H01G9/0029 , H01G9/012 , H01L23/642 , H01L28/40 , H01L2924/0002 , H01L2924/12044 , H01L2924/19015 , H01L2924/3011 , H01L2924/00
Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.
Abstract translation: 提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。 衬底具有通孔，并且板电容器在衬底上。 至少一个通孔电容器和至少一个平板电容器是并联的。 通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。 第一阴极层被第二阴极层覆盖。 第二阴极层的导电率大于第一阴极层的导电率。
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公开(公告)号：US08289679B2
公开(公告)日：2012-10-16
申请号：US12776442
申请日：2010-05-10
Applicant: Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
Inventor： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
Abstract: A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.
Abstract translation: 解耦装置包括引线框架，电容器单元，金属层和高介电有机 - 无机复合材料层。 引线框架包括阴极端子部分和阳极端子部分。 电容器单元设置在引线框架上。 电容器单元包括阴极部分，阳极部分和位于阴极部分和阳极部分之间的绝缘部分。 阴极部分电连接到阴极端子部分，并且阳极部分电连接到阳极端子部分。 高介电有机 - 无机复合材料层通过金属层并联连接到电容器单元。
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公开(公告)号：US20090161298A1
公开(公告)日：2009-06-25
申请号：US12050188
申请日：2008-03-18
Applicant: Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
Inventor： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
CPC classification number: H01G9/15 , H01G9/0029 , H01G9/012 , H01L23/642 , H01L28/40 , H01L2924/0002 , H01L2924/12044 , H01L2924/19015 , H01L2924/3011 , H01L2924/00
Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.
Abstract translation: 提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。 衬底具有通孔，并且板电容器在衬底上。 至少一个通孔电容器和至少一个平板电容器是并联的。 通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。 第一阴极层被第二阴极层覆盖。 第二阴极层的导电率大于第一阴极层的导电率。
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公开(公告)号：US20090159322A1
公开(公告)日：2009-06-25
申请号：US12046422
申请日：2008-03-11
Applicant: Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
Inventor： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
CPC classification number: H05K1/162 , H01G9/012 , H01G11/48 , H05K2201/09809 , H05K2203/0315 , Y02E60/13 , Y10T29/417 , Y10T29/435
Abstract: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.
Abstract translation: 提供至少包括基板，阳极层，电介质层，第一阴极层和第二阴极层的通孔电容器。 基板具有多个通孔。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 电介质层设置在阳极层的多孔结构上。 第一阴极层覆盖电介质层的表面。 第二阴极层覆盖第一阴极层的表面，第二阴极层的导电率大于第一阴极层的导电率。 通孔电容器可用于阻抗控制，因为通孔的阴极层用于信号传输。
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