发明申请
- 专利标题: LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING DEVICE
- 专利标题(中): 发光元件安装基板和发光器件
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申请号: US13989570申请日: 2011-11-25
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公开(公告)号: US20130242565A1公开(公告)日: 2013-09-19
- 发明人: Takeyuki Arai , Minoru Nakasuga , Tetsurou Nakamoto
- 申请人: Takeyuki Arai , Minoru Nakasuga , Tetsurou Nakamoto
- 申请人地址: JP Kyoto-shi
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: JP Kyoto-shi
- 优先权: JP2010-262572 20101125; JP2011-016747 20110128; JP2011-059470 20110317
- 国际申请: PCT/JP2011/077212 WO 20111125
- 主分类号: F21V21/00
- IPC分类号: F21V21/00
摘要:
There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
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