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公开(公告)号：US20130242565A1
公开(公告)日：2013-09-19
申请号：US13989570
申请日：2011-11-25
IPC分类号： F21V21/00
CPC分类号： F21V21/00 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H05K1/0274 , H05K1/0306 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00012 , H01L2924/01033 , H01L2224/45099
摘要： There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
摘要翻译： 提供了一种在基板主体和金属部分之间具有高结合强度的发光元件安装基板和在基板主体和金属部分之间具有高粘合强度的发光器件，并且具有高可靠性。 发光元件安装基板包括由陶瓷烧结体形成的基板主体（20） 和含银金属部分（2），存在于基板主体的面对金属部分的部分的含银区域（4）穿过结合基板主体和含银金属部分的接合部分。 因此，可以提高基板主体（20）和金属部（2）之间的接合强度。
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公开(公告)号：US09170003B2
公开(公告)日：2015-10-27
申请号：US13989570
申请日：2011-11-25
CPC分类号： F21V21/00 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H05K1/0274 , H05K1/0306 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00012 , H01L2924/01033 , H01L2224/45099
摘要： There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
摘要翻译： 提供了一种在基板主体和金属部分之间具有高结合强度的发光元件安装基板和在基板主体和金属部分之间具有高粘合强度的发光器件，并且具有高可靠性。 发光元件安装基板包括由陶瓷烧结体形成的基板主体（20） 和含银金属部分（2），存在于基板主体的面对金属部分的部分的含银区域（4）穿过结合基板主体和含银金属部分的接合部分。 因此，可以提高基板主体（20）和金属部（2）之间的接合强度。
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公开(公告)号：USD248766S
公开(公告)日：1978-08-01
申请号：US688339
申请日：1976-05-20
申请人： Takeyuki Arai
设计人： Takeyuki Arai
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