发明申请
- 专利标题: SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- 专利标题(中): 半导体结构及其形成方法
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申请号: US13425221申请日: 2012-03-20
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公开(公告)号: US20130249007A1公开(公告)日: 2013-09-26
- 发明人: Chien-Wen Chu , Wing-Chor Chan , Shyi-Yuan Wu
- 申请人: Chien-Wen Chu , Wing-Chor Chan , Shyi-Yuan Wu
- 申请人地址: TW Hsinchu
- 专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/336
摘要:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a substrate, a first source/drain region, a second source/drain region, a first stack structure and a second stack structure. The first source/drain region is formed in the substrate. The second source/drain region is formed in the substrate. The first stack structure is on the substrate between the first source/drain region and the second source/drain region. The first stack structure comprises a first dielectric layer and a first conductive layer on the first dielectric layer. The second stack structure is on the first stack structure. The second stack structure comprises a second dielectric layer and a second conductive layer on the second dielectric layer.
公开/授权文献
- US09029950B2 Semiconductor structure and method for forming the same 公开/授权日:2015-05-12
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