发明申请
US20130249095A1 GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH
审中-公开
具有铜背板的GALLIUM ARSENIDE设备用于直接DIE焊接附件
- 专利标题： GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH
- 专利标题（中）： 具有铜背板的GALLIUM ARSENIDE设备用于直接DIE焊接附件
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申请号： US13429725申请日： 2012-03-26
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公开(公告)号： US20130249095A1公开(公告)日： 2013-09-26
- 发明人: Hong Shen
- 申请人： Hong Shen
- 申请人地址： US MA Woburn
- 专利权人： SKYWORKS SOLUTIONS, INC.
- 当前专利权人： SKYWORKS SOLUTIONS, INC.
- 当前专利权人地址： US MA Woburn
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. Direct die solder (DDS) attach can be achieved by use of electroless nickel plating of the copper contact layer followed by a palladium flash. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices.
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