Invention Application
- Patent Title: Solid Electrolytic Capacitor and Method of Manufacture
- Patent Title (中): 固体电解电容器及其制造方法
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Application No.: US13894679Application Date: 2013-05-15
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Publication No.: US20130250486A1Publication Date: 2013-09-26
- Inventor: Brandon Summey , Jeffrey Poltorak , Philip M. Lessner , Yongjian Qiu , Randolph S. Hahn , David Jacobs , Keith R. Brenneman , Albert K. Harrington , Chris Stolarski
- Applicant: Kemet Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Main IPC: H01G9/15
- IPC: H01G9/15 ; H01G9/00

Abstract:
An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
Public/Granted literature
- US09053866B2 Solid electrolytic capacitor and method of manufacture Public/Granted day:2015-06-09
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