公开(公告)号：US20240237220A1

公开(公告)日：2024-07-11

申请号：US18615432

申请日：2024-03-25

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Robert Ramsbottom ,  Jeffrey Poltorak ,  Courtney Elliott

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/028 ,  H05K1/0366 ,  H05K1/115 ,  H05K2201/10015

Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

公开(公告)号：US20230065146A1

公开(公告)日：2023-03-02

申请号：US17462459

申请日：2021-08-31

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak ,  Robert Andrew Ramsbottom ,  Kevin A. Agosto

IPC: H01G9/08 ,  H01G9/26 ,  H01G9/042

Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with
a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.

公开(公告)号：US10079113B2

公开(公告)日：2018-09-18

申请号：US15381526

申请日：2016-12-16

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak ,  Robert Andrew Ramsbottom

IPC: H01G9/012 ,  H01G9/15 ,  H01G9/00 ,  H01G9/042 ,  H01G9/048 ,  H01G9/07 ,  H01G9/08 ,  H01G9/045

CPC classification number: H01G9/012 ,  H01G9/0032 ,  H01G9/042 ,  H01G9/045 ,  H01G9/048 ,  H01G9/052 ,  H01G9/07 ,  H01G9/08 ,  H01G9/10 ,  H01G9/15

Abstract: An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.

公开(公告)号：US09941056B2

公开(公告)日：2018-04-10

申请号：US14162268

申请日：2014-01-23

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak

IPC: H01G9/012 ,  H01G9/10 ,  H01G9/15

CPC classification number: H01G9/012 ,  H01G9/10 ,  H01G9/15 ,  Y10T29/435

Abstract: An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.

公开(公告)号：US11361908B2

公开(公告)日：2022-06-14

申请号：US17089875

申请日：2020-11-05

Applicant: KEMET Electronics Corporation

Inventor： Antony Chacko ,  Randolph S. Hahn ,  David Jacobs ,  Brandon Summey

IPC: H01G9/10 ,  H01G9/00 ,  H01G9/15 ,  H01G9/04 ,  H01G9/042

Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

公开(公告)号：US10319529B2

公开(公告)日：2019-06-11

申请号：US14180946

申请日：2014-02-14

Applicant: Kemet Electronics Corporation

Inventor： Yanming Liu ,  Jessica P. Love ,  Brandon Summey

IPC: H01G4/38 ,  H01G4/005 ,  H01G9/00 ,  H01G9/055 ,  H01G4/008

Abstract: A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.

公开(公告)号：US20180211790A1

公开(公告)日：2018-07-26

申请号：US15926391

申请日：2018-03-20

Applicant: KEMET Electronics Corporation

Inventor： Randolph S. Hahn ,  Jeffrey Poltorak ,  Brandon Summey ,  Antony P. Chacko ,  John T. Kinard ,  Philip M. Lessner

IPC: H01G9/15 ,  H01G9/048

CPC classification number: H01G9/15 ,  H01G9/0036 ,  H01G9/0425 ,  H01G9/048

Abstract: An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.

公开(公告)号：US20140211371A1

公开(公告)日：2014-07-31

申请号：US14162268

申请日：2014-01-23

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak

IPC: H01G9/048 ,  H01G9/00

CPC classification number: H01G9/012 ,  H01G9/10 ,  H01G9/15 ,  Y10T29/435

Abstract: An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.

Abstract translation: 提供了一种改进的电容器，其具有至少一个在阳极上具有电介质的阳极和从阳极延伸的阳极引线。 导电阴极层位于电介质上。 阳极引线框架电连接到阳极，阴极引线框架电连接到阴极。 密封剂封装阳极，阳极引线框架的一部分和阴极引线框架的一部分，使得阳极引线框架从密封剂延伸以形成外部阳极引线框架，并且阴极引线框架从密封剂延伸以形成外部阴极引线框架。 提供至少一个次级电连接，其中次级电连接与阴极电接触并且延伸通过密封剂到外部阴极引线框架，或者次级电触点与阳极电接触并延伸穿过密封剂到外部 阳极引线框架

公开(公告)号：US09741494B2

公开(公告)日：2017-08-22

申请号：US14180842

申请日：2014-02-14

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Yanming Liu

IPC: H01G4/38 ,  H01G9/00 ,  H01G4/005 ,  H01G9/055

CPC classification number: H01G4/38 ,  H01G4/005 ,  H01G4/008 ,  H01G9/0029 ,  H01G9/055 ,  Y10T29/302 ,  Y10T29/43

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

公开(公告)号：US20170178821A1

公开(公告)日：2017-06-22

申请号：US15381526

申请日：2016-12-16

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak ,  Robert Andrew Ramsbottom

IPC: H01G9/012 ,  H01G9/048 ,  H01G9/00 ,  H01G9/08 ,  H01G9/15 ,  H01G9/042 ,  H01G9/07

CPC classification number: H01G9/012 ,  H01G9/0032 ,  H01G9/042 ,  H01G9/045 ,  H01G9/048 ,  H01G9/052 ,  H01G9/07 ,  H01G9/08 ,  H01G9/10 ,  H01G9/15

Abstract: An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.