发明申请
- 专利标题: THERMAL INTERFACE ELEMENT AND ARTICLE INCLUDING THE SAME
- 专利标题(中): 热接口元件和包括它的文章
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申请号: US12494775申请日: 2009-06-30
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公开(公告)号: US20130258600A1公开(公告)日: 2013-10-03
- 发明人: Tao Deng , Todd Garrett Wetzel , Kripa Kiran Varanasi , Ambarish Jayant Kulkarni , Boris Russ
- 申请人: Tao Deng , Todd Garrett Wetzel , Kripa Kiran Varanasi , Ambarish Jayant Kulkarni , Boris Russ
- 申请人地址: US NY SCHENECTADY
- 专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人地址: US NY SCHENECTADY
- 主分类号: F28F7/00
- IPC分类号: F28F7/00 ; H05K7/20
摘要:
An article and method of forming the article is disclosed. The article includes a heat source, a substrate, and a thermal interface element having a plurality of freestanding nanosprings disposed in thermal communication with the substrate and the heat source. The nanosprings of the article include at least one inorganic material and also at least 50% of the nanosprings have a thermal conductivity of at least 1 watt/mK per nano spring.
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