- 专利标题： CIRCUIT BOARD ASSEMBLY WITH PADS AND CONNECTION LINES HAVING SAME RESISTANCE VALUE AS THE PADS AND IMPEDANCE MATCHING METHOD
-
申请号： US13534217申请日： 2012-06-27
-
公开(公告)号： US20130269983A1公开(公告)日： 2013-10-17
- 发明人: KAI-WEN WU
- 申请人： KAI-WEN WU
- 申请人地址： TW Tu-Cheng
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： TW Tu-Cheng
- 优先权： TW101113392 20120416
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; G01R31/28 ; H01R43/00
摘要：
A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.
公开/授权文献
- US08887385B2 Impedance matching method 公开/授权日：2014-11-18