- 专利标题： PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME
- 专利标题（中）： 包装结构及其形成方法
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申请号： US13526073申请日： 2012-06-18
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公开(公告)号： US20130270700A1公开(公告)日： 2013-10-17
- 发明人: Chen-Hua YU , Mirng-Ji LII , Chung-Shi LIU , Meng-Tse CHEN , Wei-Hung LIN , Ming-Da CHENG
- 申请人： Chen-Hua YU , Mirng-Ji LII , Chung-Shi LIU , Meng-Tse CHEN , Wei-Hung LIN , Ming-Da CHENG
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/78
摘要：
The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.
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