发明申请
- 专利标题: Rigid Interconnect Structures in Package-on-Package Assemblies
- 专利标题(中): 封装在封装组件中的刚性互连结构
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申请号: US13452589申请日: 2012-04-20
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公开(公告)号: US20130277841A1公开(公告)日: 2013-10-24
- 发明人: Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
- 申请人: Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L25/07
- IPC分类号: H01L25/07 ; H01L21/60
摘要:
System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.