发明申请
- 专利标题: Plasma Potential Modulated ION Implantation Apparatus
- 专利标题(中): 等离子体电位调制离子注入装置
-
申请号: US13457455申请日: 2012-04-26
-
公开(公告)号: US20130287963A1公开(公告)日: 2013-10-31
- 发明人: Svetlana B. Radovanov , Ludovic Godet , Bon-Woong Koo , Timothy J. Miller
- 申请人: Svetlana B. Radovanov , Ludovic Godet , Bon-Woong Koo , Timothy J. Miller
- 申请人地址: US MA Gloucester
- 专利权人: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人地址: US MA Gloucester
- 主分类号: C23C14/48
- IPC分类号: C23C14/48
摘要:
An ion implantation apparatus including a first plasma chamber, a second plasma chamber and an extraction electrode disposed therebetween. The first and second plasma chambers configured to house respective plasmas in response to the introduction of a different feed gases therein. The extraction electrode is electrically isolated from the plasma chamber. An extraction voltage is applied to the first plasma chamber above a bias potential used to generate the plasma therein. The extraction voltage drives the plasma potential to accelerate the ions in the first plasma to a desired implant energy. The accelerated ions pass through an aperture in the extraction electrode and are directed toward a substrate housed within the second plasma chamber for implantation.
信息查询
IPC分类: