发明申请
- 专利标题： Wafer Level Reflector for LED Packaging
- 专利标题（中）： LED封装晶圆级反射器
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申请号： US13941784申请日： 2013-07-15
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公开(公告)号： US20130299855A1公开(公告)日： 2013-11-14
- 发明人: Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hain-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
- 申请人： TSMC Solid State Lighting Ltd.
- 主分类号： H01L27/15
- IPC分类号： H01L27/15
摘要：
An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
公开/授权文献
- US09343505B2 Wafer level reflector for LED packaging 公开/授权日：2016-05-17
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