-
公开(公告)号：US20130157395A1
公开(公告)日：2013-06-20
申请号：US13767994
申请日：2013-02-15
发明人： Chung Yu Wang
IPC分类号： H01L33/64
CPC分类号： H01L33/64 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16235 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15156 , H01L2924/15788 , H01L2924/18161 , H01L2924/00
摘要： A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
摘要翻译： 封装系统包括具有通过衬底的至少一个第一导热结构的衬底。 至少一个第二导热结构设置在所述至少一个第一导热结构上。 至少一个发光二极管（LED）设置在所述至少一个第二导热结构上。
-
公开(公告)号：US20150083996A1
公开(公告)日：2015-03-26
申请号：US14556273
申请日：2014-12-01
发明人： Chung Yu Wang
IPC分类号： H01L33/64 , H01L33/32 , H01L27/15 , H01L33/62 , H01L33/10 , H01L33/58 , H01L33/06 , H01L33/00
CPC分类号： H01L33/647 , H01L23/481 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/94 , H01L24/97 , H01L27/15 , H01L33/0025 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2224/83815 , H01L2224/83895 , H01L2224/92247 , H01L2224/94 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01026 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2933/0066 , H01L2924/00014 , H01L2924/0781 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED.
摘要翻译： 发光器件（LED）封装部件包括载体晶片。 载体晶片包括被配置为电连接载体晶片的相对侧上的特征的第一穿通基板通孔（TSV）。 发光装置（LED）被结合到载体晶片上。 LED电连接到第一TSV。 导电热界面材料（TIM）位于第一TSV和LED之间并邻接第一TSV和LED。
-
公开(公告)号：US20130299855A1
公开(公告)日：2013-11-14
申请号：US13941784
申请日：2013-07-15
发明人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hain-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译： 通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器 在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。
-
公开(公告)号：US09343505B2
公开(公告)日：2016-05-17
申请号：US13941784
申请日：2013-07-15
发明人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Min Lin , Shang-Yu Tsai
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
-
公开(公告)号：US08628984B2
公开(公告)日：2014-01-14
申请号：US13767994
申请日：2013-02-15
发明人： Chung Yu Wang
IPC分类号： H01L31/00
CPC分类号： H01L33/64 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16235 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15156 , H01L2924/15788 , H01L2924/18161 , H01L2924/00
摘要： A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
摘要翻译： 封装系统包括具有通过衬底的至少一个第一导热结构的衬底。 至少一个第二导热结构设置在所述至少一个第一导热结构上。 至少一个发光二极管（LED）设置在所述至少一个第二导热结构上。
-
-
-
-
搜索结果
5 条记录 (耗时 0.015 秒)
