发明申请
- 专利标题： LID ATTACH PROCESS
- 专利标题（中）： LID附件过程
-
申请号： US13952392申请日： 2013-07-26
-
公开(公告)号： US20130309814A1公开(公告)日： 2013-11-21
- 发明人: Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- 申请人： Seah Sun Too , Maxat Touzelbaev , Janet Kirkland
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
公开/授权文献
- US08865527B2 Lid attach process 公开/授权日：2014-10-21
信息查询
IPC分类:
