发明申请
- 专利标题: DIE AND DIE DEVICE
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申请号: US13930279申请日: 2013-06-28
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公开(公告)号: US20130312580A1公开(公告)日: 2013-11-28
- 发明人: Kinshiro NAITO , Masayuki SHIMIZU , Shigeru ENDO , Takashi MATSUMOTO , Hiroshi NAKAI , Hiroyuki KOBAYASHI
- 申请人: Masayuki SHIMIZU , Shigeru ENDO , Takashi MATSUMOTO , Hiroshi NAKAI , Hiroyuki KOBAYASHI
- 申请人地址: JP Kanagawa
- 专利权人: AMADA COMPANY, LIMITED
- 当前专利权人: AMADA COMPANY, LIMITED
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2002-177211 20020618; JP2003-142267 20030520
- 主分类号: B26D7/18
- IPC分类号: B26D7/18
摘要:
A die body includes a die hole for punching a work. A core, including a discharge hole, which is in communication with the die hole, is provided in the die body. The core is provided with a plurality of fluid injection ports through which fluid is injected downward of the discharge hole. The die body is provided with inflow ports through which compressed fluid flows into the fluid injection ports. The core is made of resin. The discharge hole is tapered toward its upper side. An outer peripheral surface of the die body is provided with a peripheral groove which is in communication with the inflow ports.
公开/授权文献
- US09138909B2 Die and die device 公开/授权日:2015-09-22
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