发明申请
- 专利标题： ULTRA-THIN NEAR-HERMETIC PACKAGE BASED ON RAINIER
- 专利标题（中）： 基于RAINIER的超薄膜近似包装
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申请号： US13955720申请日： 2013-07-31
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公开(公告)号： US20130316501A1公开(公告)日： 2013-11-28
- 发明人: Kenneth Allen Honer , Philip Damberg
- 申请人： Tessera, Inc.
- 申请人地址： US CA San Jose
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/56
摘要：
A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.
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