发明申请
US20130318266A1 ON-PACKAGE INPUT/OUTPUT ARCHITECTURE 有权
封装输入/输出结构

  • 专利标题: ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
  • 专利标题(中): 封装输入/输出结构
  • 申请号: US13995007
    申请日: 2011-12-22
  • 公开(公告)号: US20130318266A1
    公开(公告)日: 2013-11-28
  • 发明人: Thomas P. ThomasRajesh Kumar
  • 申请人: Thomas P. ThomasRajesh Kumar
  • 国际申请: PCT/US11/66971 WO 20111222
  • 主分类号: G06F13/42
  • IPC分类号: G06F13/42
ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
摘要:
An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
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