发明申请
- 专利标题: ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
- 专利标题(中): 封装输入/输出结构
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申请号: US13995007申请日: 2011-12-22
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公开(公告)号: US20130318266A1公开(公告)日: 2013-11-28
- 发明人: Thomas P. Thomas , Rajesh Kumar
- 申请人: Thomas P. Thomas , Rajesh Kumar
- 国际申请: PCT/US11/66971 WO 20111222
- 主分类号: G06F13/42
- IPC分类号: G06F13/42
摘要:
An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
公开/授权文献
- US09519609B2 On-package input/output architecture 公开/授权日:2016-12-13
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