A dual electroplating cell comprising: (a) an electrolyte component containing therein ions of a first metal; (b) a porous cathode current collector having surface areas to capture and store metal ions directly thereon, wherein the cathode current collector has a specific surface area greater than 100 m2/g that is in direct contact with said electrolyte; (c) a porous anode current collector having surface areas to capture and store metal ions thereon, wherein the anode current collector has a specific surface area greater than 100 m2/g that is in direct contact with the electrolyte; (d) a porous separator disposed between the anode and the cathode; and (e) an ion source of the first metal disposed in the anode current collector or the cathode current collector and in electronic contact therewith to obtain an open circuit voltage (OCV) from 0.3 volts to 3.5 volts when the cell is made.