NOVEL CATHODE CONDUCTIVE ROLLER DEVICE FOR SHEET-TYPE PLATING OR SHEET-TYPE CLEANING MACHINE

    公开(公告)号:US20240360583A1

    公开(公告)日:2024-10-31

    申请号:US18353215

    申请日:2023-07-17

    申请人: Wenzhong Chen

    发明人: Wenzhong Chen

    IPC分类号: C25D17/12 C25D17/00

    CPC分类号: C25D17/12 C25D17/005

    摘要: The invention discloses a novel cathode conductive roller device for sheet-type plating or sheet-type cleaning machine wherein a cathode conductive roller device is arranged between the soaking tanks (the cathode conductive roller doesn't generate circuit will suffice, no matter being soaked or not soaked in plating solution or electrolyte); an anode plate device is arranged in the soaking tank; a matched conductive plate tank device is arranged below the cathode conductive roller; compared with the prior art, the invention has following advantages: the whole structure is simple and exquisite, the selection, connection and whole working modes of parts are reasonable and complete, and the current is concentrated and uniformly distributed on semiconductor product or circuit board when the method is used for plating or electrolytic degreasing, achieving better product plating or electrolytic degreasing effect.

    Methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition

    公开(公告)号:US11827993B1

    公开(公告)日:2023-11-28

    申请号:US17478687

    申请日:2021-09-17

    CPC分类号: C25D17/12 C25D3/02

    摘要: Provided are methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition, e.g., less than 200° C. Specifically, these processes allow precise control of the morphology, composition, and size of deposited structures. For example, the deposited structure may be doped, alloyed, or surface treated during their deposition using a combination of different precursors. In particular, silicon structure may be pre-lithiated while these structures are being formed. The selection of working electrodes (surface size and properties), electrolyte composition, and other parameters result in different types of structures, e.g., precipitating from the electrolyte or deposited on the electrode. Low-temperature plating does not require a lot of energy and volatile and invisible precursors. Furthermore, this plating produces a more confined waste stream, suitable for post-reaction recycling. Finally, low-temperature electrochemical deposition can be readily scaled up such that plating bathes and electrode sizes can be chosen to fit the production requirements.

    Electrode for an eloxal process
    7.
    发明授权

    公开(公告)号:US11542628B2

    公开(公告)日:2023-01-03

    申请号:US17054066

    申请日:2019-04-02

    发明人: Dennis Monpetit

    摘要: The present disclosure relates to an electrode for eloxing a component, in particular a component of a vehicle brake system, comprising an electrolyte inlet for feeding an electrolyte into the electrode, an inlet channel, which connects the electrolyte inlet to an electrolyte outlet opening formed in the region of an outer surface of the electrode, an electrolyte inlet opening formed in the region of the outer surface of the electrode at a distance from the electrolyte outlet opening, an electrolyte flow path, which runs between the electrolyte outlet opening and the electrolyte inlet opening along the outer surface of the electrode and is designed to bring a surface portion of the component, which surface portion is to be eloxed, into fluid contact with the electrolyte flowing through the electrolyte flow path, an outlet channel, and an electrolyte outlet.

    SURFACE TREATMENT DEVICE
    10.
    发明申请

    公开(公告)号:US20220267922A1

    公开(公告)日:2022-08-25

    申请号:US17742990

    申请日:2022-05-12

    IPC分类号: C25D17/12 C25D5/02 C25D7/04

    摘要: A surface treatment device utilizes an electrode device. The electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.