发明申请
- 专利标题: Semiconductor Device and Method of Forming the Same
- 专利标题(中): 半导体器件及其形成方法
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申请号: US13486343申请日: 2012-06-01
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公开(公告)号: US20130320452A1公开(公告)日: 2013-12-05
- 发明人: Clement Hsingjen Wann , Chih-Hao Chang , Shou Zen Chang , Chih-Hsin Ko , Yasutoshi Okuno , Andrew Joseph Kelly
- 申请人: Clement Hsingjen Wann , Chih-Hao Chang , Shou Zen Chang , Chih-Hsin Ko , Yasutoshi Okuno , Andrew Joseph Kelly
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/336
摘要:
A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a semiconductor substrate including an active region including a plurality of device regions. The semiconductor device further includes a first device disposed in a first device region of the plurality of device regions, the first device including a first gate structure, first gate spacers disposed on sidewalls of the first gate structure, and first source and drain features. The semiconductor device further includes a second device disposed in a second device region of the plurality of device regions, the second device including a second gate structure, second gate spacers disposed on sidewalls of the second gate structure, and second source and drain features. The second and first source and drain features having a source and drain feature and a contact feature in common. The common contact feature being a self-aligned contact.
公开/授权文献
- US08759920B2 Semiconductor device and method of forming the same 公开/授权日:2014-06-24
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