An approach is provided for applying a release agent to a substrate having a first surface and a second surface. The approach involves causing, at least in part, a release agent supply device to supply release agent to a release agent applicator. The approach also involves causing, at least in part, a release agent metering device configured to control an amount of release agent applied to a roller configured to apply release agent to the first surface of the substrate. The roller is configured to accommodate the substrate under a tension over at least a portion of a circumference of the roller such that a pressure is exerted between the roller and the first surface of the substrate.