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发明申请
US20130336837A1 Lead-Free Solder Alloy for Vehicle Glass 有权
无铅焊接合金车载玻璃

Lead-Free Solder Alloy for Vehicle Glass
摘要：
A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass % of Cu and 0.001 to 0.01 mass % of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance.
摘要（中）：

根据本发明的用于车辆用玻璃的无铅焊料合金，含有26.0〜56.0质量％的In，0.1〜5.0质量％的Ag，0.002〜0.05质量％的Ti，0.001〜0.01质量％的Si，余量 是Sn。 无铅焊料合金可以任选地含有0.005〜0.1质量％的Cu和0.001〜0.01质量％的B。该焊料合金可以适当地应用车载玻璃，并且对玻璃材料显示出良好的接合强度，并且耐酸性高，耐盐水性 和耐温循环电阻。

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