公开(公告)号：US20250010409A1

公开(公告)日：2025-01-09

申请号：US18712634

申请日：2022-11-18

Applicant: ORMET CIRCUITS, INC.

Inventor： YANRONG SHI ,  SHENGYI LI ,  MATTHEW WROSCH ,  CATHERINE SHEARER

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/362 ,  B23K101/36

Abstract: To provide a composition for electromagnetic wave shield capable of forming a sintered compact for electromagnetic wave shield excellent in electromagnetic wave shield effect. SOLUTION: A composition for electromagnetic wave shield includes: a metal particle A, a metal particle B with a lower fusion point than the metal particle A; a metal particle C which includes a metal composition contained in the metal particle B and is an alloy particle with a lower fusion point than the metal particle B; and resin. Between the metal particle A, the metal particle B and the metal particle C, transient liquid phase sintering is possible.

公开(公告)号：US12191405B2

公开(公告)日：2025-01-07

申请号：US17612023

申请日：2020-04-08

Applicant: SHANGRAO XINYUAN YUEDONG TECHNOLOGY DEVELOPMENT CO. LTD.

Inventor： Kyungdong Lee ,  Jungmin Ha ,  Youngsung Yang ,  Juhwa Cheong

IPC: H01L31/048 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0236 ,  H01L31/05 ,  H01L31/18 ,  B23K101/40

Abstract: In a method for manufacturing a solar cell panel according to an embodiment of the present invention, a step of forming an electrode comprises the steps of: forming a main electrode part on a conductive region; and forming a connection electrode part on the main electrode part by using a paste comprising metal particles having a first metal, a solder material having a second metal different from the first metal, and an adhesive material.

公开(公告)号：US12179291B2

公开(公告)日：2024-12-31

申请号：US18126695

申请日：2023-03-27

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Takashi Saito ,  Shunsaku Yoshikawa ,  Naoko Izumita

IPC: B23K35/26 ,  C22C13/00 ,  H05K1/02 ,  H05K3/34 ,  B23K101/42

Abstract: A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.

公开(公告)号：US12172242B2

公开(公告)日：2024-12-24

申请号：US17297966

申请日：2019-11-29

Applicant: NIHON SUPERIOR CO., LTD.

Inventor： Takatoshi Nishimura ,  Tetsuro Nishimura ,  Tetsuya Akaiwa

IPC: C22C13/00 ,  B23K35/26 ,  B23K103/08

Abstract: A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.

公开(公告)号：US12138715B2

公开(公告)日：2024-11-12

申请号：US17756875

申请日：2020-09-04

Applicant: Heraeus Deutschland Gmbh & Co. KG

Inventor： Lei Wang ,  Sebastian Fritzsche

IPC: B23K35/36 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/365 ,  C22C13/00 ,  B23K101/36

Abstract: Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.

公开(公告)号：US20240367270A1

公开(公告)日：2024-11-07

申请号：US18682007

申请日：2022-07-27

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Sarii YAMAGUCHI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B22F1/05 ,  B22F1/145 ,  B23K35/26 ,  B23K35/365

Abstract: Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.

公开(公告)号：US20240341040A1

公开(公告)日：2024-10-10

申请号：US18745805

申请日：2024-06-17

Applicant: DELL PRODUCTS L.P.

Inventor： Subramanian Vasudevan ,  Edward Rhem ,  Philip Conde ,  Wallace Ables ,  Edwin C. Tinsley

IPC: H05K3/34 ,  B23K1/00 ,  B23K35/26 ,  B23K101/42

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3489 ,  B23K2101/42

Abstract: Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

公开(公告)号：US12060626B2

公开(公告)日：2024-08-13

申请号：US17423465

申请日：2020-01-30

Applicant: METALLO BELGIUM

Inventor： Bert Coletti ,  Yves De Visscher ,  Charles Geenen ,  Jan Dirk A. Goris ,  Koen Govaerts ,  Pelle Lemmens ,  Kris Mannaerts

IPC: C22C3/00 ,  B23K35/26 ,  C22C11/10 ,  C22C13/00 ,  C22C30/04

CPC classification number: C22C3/005 ,  B23K35/262 ,  B23K35/268 ,  C22C11/10 ,  C22C13/00 ,  C22C30/04

Abstract: Metal compositions and production processes are described. A process for the production of a metal composition includes a first distillation step separating off by evaporation primarily lead from a solder mixture of lead, tin, and antimony, thereby producing as a first concentrated lead stream. The process includes a second distillation step separating primarily lead and antimony from the metal composition, thereby producing a second concentrated lead stream and a second bottom product. The method also includes a third distillation step separating primarily lead and antimony from the second concentrated lead stream, thereby producing a third concentrated lead stream and a third bottom product.

公开(公告)号：US20240238915A1

公开(公告)日：2024-07-18

申请号：US18289495

申请日：2021-12-28

Applicant: NIHON SUPERIOR CO., LTD.

Inventor： Tetsuro NISHIMURA ,  Kenji NAKAMURA ,  Junya MASUDA

IPC: B23K35/26 ,  B23K35/02 ,  C22C12/00 ,  C22C13/02

CPC classification number: B23K35/264 ,  B23K35/025 ,  C22C12/00 ,  C22C13/02

Abstract: The present invention relates to a solder paste containing solder powder and a flux, wherein the solder powder is a lead-free solder alloy having a solidus temperature of 150° C. or less, the flux contains: a rosin; a solvent; a thixotropic agent; and an organic acid and an imidazole as an activator, the organic acid includes one or more kinds of dicarboxylic acids having 4 to 6 carbon atoms, and the imidazole includes one or more kinds among imidazole compounds having 3 to 6 carbon atoms and derivatives thereof.

公开(公告)号：US20240238914A1

公开(公告)日：2024-07-18

申请号：US18410462

申请日：2024-01-11

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa ,  Yuki Iijima ,  Kanta Dei ,  Takahiro Matsufuji ,  Kota Sugisawa ,  Shigeto Suzuki

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/02 ,  B23K101/42

CPC classification number: B23K35/262 ,  B23K35/025 ,  C22C13/02 ,  B23K2101/42

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.