发明申请
- 专利标题： Package on Package Devices and Methods of Packaging Semiconductor Dies
- 专利标题（中）： 封装器件封装和封装半导体芯片的方法
-
申请号： US13532402申请日： 2012-06-25
-
公开(公告)号： US20130341786A1公开(公告)日： 2013-12-26
- 发明人: Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- 申请人： Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/56
摘要：
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.