A conversion component for arrangement downstream at a radiation-outcoupling face of a radiation-emitting semiconductor chip is specified. The component has a converter element with a first major face, a second major face opposite the first major face and at least one side face. The side face connects together the two major faces. The converter element contains at least one luminescence conversion material, which is suitable for absorbing electromagnetic radiation of one wavelength range and for re-emitting the absorbed electromagnetic radiation in another wavelength range with larger wavelengths than the absorbed radiation. A reflective coating is designed to reflect electromagnetic radiation exiting from the converter element and to reflect it at least in part back into the converter element. The reflective coating covers the converter element at least in places at the at least one side face.