发明申请
- 专利标题: Multiple Die Packaging Interposer Structure and Method
- 专利标题(中): 多模封装插件结构与方法
-
申请号: US13539182申请日: 2012-06-29
-
公开(公告)号: US20140001612A1公开(公告)日: 2014-01-02
- 发明人: Chen-Hua Yu , Mirng-Ji Lii , Hao-Yi Tsai , Jui-Pin Hung , Chien-Hsun Lee , Kai-Chiang Wu
- 申请人: Chen-Hua Yu , Mirng-Ji Lii , Hao-Yi Tsai , Jui-Pin Hung , Chien-Hsun Lee , Kai-Chiang Wu
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L25/065 ; H01L21/98
摘要:
System and method for providing a multiple die interposer structure. An embodiment comprises a plurality of interposer studs in a molded interposer, with a redirection layer on each side of the interposer. Additionally, the interposer studs may be initially attached to a conductive mounting plate by soldering or wirebond welding prior to molding the interposer, with the mounting plate etched to form one of the redirection layers. Integrated circuit dies may be attached to the redirection layers on each side of the interposer, and interlevel connection structures used to mount and electrically connect a top package having a third integrated circuit to the interposer assembly.
公开/授权文献
- US08703539B2 Multiple die packaging interposer structure and method 公开/授权日:2014-04-22