Invention Application
- Patent Title: POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS FOR POLISHING A WORKPIECE, AND METHOD OF POLISHING A WORKPIECE USING THE CHEMICAL MECHANICAL POLISHING APPARATUS
- Patent Title (中): 用于抛光工件的抛光垫和化学机械抛光装置以及使用化学机械抛光装置抛光工件的方法
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Application No.: US13891702Application Date: 2013-05-10
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Publication No.: US20140004772A1Publication Date: 2014-01-02
- Inventor: Yu ISHII , Kenya ITO , Shozo TAKAHASHI , Mika SUZUKI
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2012-110941 20120514; JP2012-256027 20121122; JP2012-278901 20121221
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B37/10 ; B24B37/30 ; B24B37/04
Abstract:
A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
Public/Granted literature
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