- 专利标题: FRACTURE AWARE OPC
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申请号: US13544014申请日: 2012-07-09
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公开(公告)号: US20140013287A1公开(公告)日: 2014-01-09
- 发明人: Nian-Fuh Cheng , Yu-Po Tang , Chien-Fu Lee , Sheng-Wen Lin , Yong-Cheng Lin , Wen-Chun Huang , Ru-Gun Liu
- 申请人: Nian-Fuh Cheng , Yu-Po Tang , Chien-Fu Lee , Sheng-Wen Lin , Yong-Cheng Lin , Wen-Chun Huang , Ru-Gun Liu
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
The present disclosure describes an OPC method of preparing data for forming a mask. The method includes setting a plurality of dissection points at the main feature and further includes setting a target point at the main feature. The method includes arranging the two dissection points crossing the main feature symmetrically each other. The method includes separating two adjacent dissection points at one side of the main feature by a maximum resolution of the mask writer. The method includes dividing the main feature into a plurality of segments using the dissection points. The method includes performing an OPC convergence simulation to a target point. The method includes correcting the segments belonging to an ambit of the target point and further includes correcting the segment shared by two ambits.
公开/授权文献
- US08745550B2 Fracture aware OPC 公开/授权日:2014-06-03
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