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    VIA-FREE INTERCONNECT STRUCTURE WITH SELF-ALIGNED METAL LINE INTERCONNECTIONS
    1.
    发明申请
    VIA-FREE INTERCONNECT STRUCTURE WITH SELF-ALIGNED METAL LINE INTERCONNECTIONS 有权
    具有自对准金属线互连的无障碍互连结构

    公开(公告)号：US20130292836A1

    公开(公告)日：2013-11-07

    申请号：US13461224

    申请日：2012-05-01

    Applicant: Yu-Po Tang ,  Shih-Ming Chang ,  Ken-Hsien Hsieh ,  Ru-Gun Liu

    Inventor： Yu-Po Tang ,  Shih-Ming Chang ,  Ken-Hsien Hsieh ,  Ru-Gun Liu

    IPC: H01L23/48 ,  H01L21/28

    CPC classification number: H01L21/76838 ,  H01L21/76897 ,  H01L23/522 ,  H01L23/5221 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first conductive line disposed over a substrate. The first conductive line is located in a first interconnect layer and extends along a first direction. The semiconductor device includes a second conductive line and a third conductive line each extending along a second direction different from the first direction. The second and third conductive lines are located in a second interconnect layer that is different from the first interconnect layer. The second and third conductive lines are separated by a gap that is located over or below the first conductive line. The semiconductor device includes a fourth conductive line electrically coupling the second and third conductive lines together. The fourth conductive line is located in a third interconnect layer that is different from the first interconnect layer and the second interconnect layer.

    Abstract translation: 本发明提供一种半导体器件。 半导体器件包括设置在衬底上的第一导电线。 第一导线位于第一互连层中并沿着第一方向延伸。 半导体器件包括沿着与第一方向不同的第二方向延伸的第二导线和第三导线。 第二和第三导线位于与第一互连层不同的第二互连层中。 第二和第三导线被位于第一导电线之上或之下的间隙分开。 半导体器件包括将第二和第三导线电耦合在一起的第四导线。 第四导线位于与第一互连层和第二互连层不同的第三互连层中。

    Optical proximity correction for mask repair
    2.
    发明授权
    Optical proximity correction for mask repair 有权
    面罩修复光学接近校正

    公开(公告)号：US08572520B2

    公开(公告)日：2013-10-29

    申请号：US13409515

    申请日：2012-03-01

    Applicant: Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

    Inventor： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

    IPC: G06F17/50 ,  G06G7/62

    CPC classification number: G03F1/70 ,  G03F1/36

    Abstract: Integrated circuit (IC) methods for optical proximity correction (OPC) modeling and mask repair are described. The methods include use of an optical model that generates a simulated aerial image from an actual aerial image obtained in an optical microscope system. In the OPC modeling methods, OPC according to stage modeling is simulated, and OPC features may be added to a design layout according to the simulating OPC. In the mask repair methods, inverse image rendering is performed on the actual aerial image and diffraction image by applying an optical model that divides an incoherent exposure source into a plurality of coherent sources.

    Abstract translation: 描述了用于光学邻近校正（OPC）建模和掩模修复的集成电路（IC）方法。 这些方法包括使用从在光学显微镜系统中获得的实际空间图像生成模拟空间图像的光学模型。 在OPC建模方法中，根据阶段建模对OPC进行了仿真，根据模拟OPC可以将OPC特征加入到设计布局中。 在掩模修复方法中，通过应用将非相干曝光源分割为多个相干光源的光学模型，对实际的空间图像和衍射图像执行逆图像渲染。

    MICROSCOPE APPARATUS FOR PHASE IMAGE ACQUISITION
    3.
    发明申请
    MICROSCOPE APPARATUS FOR PHASE IMAGE ACQUISITION 有权
    用于相位图像获取的显微镜装置

    公开(公告)号：US20130155498A1

    公开(公告)日：2013-06-20

    申请号：US13328591

    申请日：2011-12-16

    Applicant: Fu-Sheng CHU ,  Chih-Shiang CHOU ,  Yu-Po TANG ,  Yan-Ying HE

    Inventor： Fu-Sheng CHU ,  Chih-Shiang CHOU ,  Yu-Po TANG ,  Yan-Ying HE

    IPC: G02B21/14 ,  G02B21/36

    CPC classification number: G02B21/14 ,  G02B21/36 ,  G02B26/06

    Abstract: A microscope apparatus includes a condenser lens to make an illuminating electromagnetic wave relatively homogeneous, a first beam splitter splitting the illuminating electromagnetic wave after the condenser lens, a movable reflector module, a second beam splitter, an objective lens to project the illuminating electromagnetic wave propagating after an object to be observed toward an observing device. The object is loaded between the first beam splitter and the second beam splitter. The microscope apparatus is configured to split the illuminating electromagnetic wave into two paths at the first beam splitter. A first path goes through the first and the second beam splitters, and a second path goes through the movable reflector module to rejoin the first path at the second beam splitter. The microscope apparatus is configured acquire phase images with interferences of the electromagnetic wave from the two paths with at least two distance settings of the movable reflector module.

    Abstract translation: 显微镜装置包括：聚光透镜，用于使照明电磁波相对均匀;第一分束器，分离聚光透镜后的照明电磁波;可移动反射器模块;第二分束器;物镜，用于投射照射电磁波; 在要观察的物体之后朝向观察装置。 物体被装载在第一分束器和第二分束器之间。 显微镜装置被配置为在第一分束器处将照明电磁波分成两个路径。 第一路径穿过第一和第二分束器，并且第二路径穿过可移动反射器模块以在第二分束器处重新加入第一路径。 显微镜装置被配置为获得具有来自两个路径的电磁波干扰的相位图像，其中可移动反射器模块具有至少两个距离设置。

    Microscope apparatus for phase image acquisition
    6.
    发明授权
    Microscope apparatus for phase image acquisition 有权
    用于相位图像采集的显微镜装置

    公开(公告)号：US08928973B2

    公开(公告)日：2015-01-06

    申请号：US13328591

    申请日：2011-12-16

    Applicant: Fu-Sheng Chu ,  Chih-Shiang Chou ,  Yu-Po Tang ,  Yan-Ying He

    Inventor： Fu-Sheng Chu ,  Chih-Shiang Chou ,  Yu-Po Tang ,  Yan-Ying He

    IPC: G02B21/00

    CPC classification number: G02B21/14 ,  G02B21/36 ,  G02B26/06

    Abstract: A microscope apparatus includes a condenser lens to make an illuminating electromagnetic wave relatively homogeneous, a first beam splitter splitting the illuminating electromagnetic wave after the condenser lens, a movable reflector module, a second beam splitter, an objective lens to project the illuminating electromagnetic wave propagating after an object to be observed toward an observing device. The object is loaded between the first beam splitter and the second beam splitter. The microscope apparatus is configured to split the illuminating electromagnetic wave into two paths at the first beam splitter. A first path goes through the first and the second beam splitters, and a second path goes through the movable reflector module to rejoin the first path at the second beam splitter. The microscope apparatus is configured acquire phase images with interferences of the electromagnetic wave from the two paths with at least two distance settings of the movable reflector module.

    Abstract translation: 显微镜装置包括：聚光透镜，用于使照明电磁波相对均匀;第一分束器，分离聚光透镜后的照明电磁波;可移动反射器模块;第二分束器;物镜，用于投射照射电磁波; 在要观察的物体之后朝向观察装置。 物体被装载在第一分束器和第二分束器之间。 显微镜装置被配置为在第一分束器处将照明电磁波分成两个路径。 第一路径穿过第一和第二分束器，并且第二路径穿过可移动反射器模块以在第二分束器处重新加入第一路径。 显微镜装置被配置为获得具有来自两个路径的电磁波干扰的相位图像，其中可移动反射器模块具有至少两个距离设置。

    Fracture aware OPC
    7.
    发明授权
    Fracture aware OPC 有权
    断裂感知OPC

    公开(公告)号：US08745550B2

    公开(公告)日：2014-06-03

    申请号：US13544014

    申请日：2012-07-09

    Applicant: Nian-Fuh Cheng ,  Yu-Po Tang ,  Chien-Fu Lee ,  Sheng-Wen Lin ,  Yong-Cheng Lin ,  Wen-Chun Huang ,  Ru-Gun Liu

    Inventor： Nian-Fuh Cheng ,  Yu-Po Tang ,  Chien-Fu Lee ,  Sheng-Wen Lin ,  Yong-Cheng Lin ,  Wen-Chun Huang ,  Ru-Gun Liu

    IPC: G06F17/50

    CPC classification number: G03F7/70441 ,  G03F1/36 ,  G03F1/70

    Abstract: The present disclosure describes an OPC method of preparing data for forming a mask. The method includes setting a plurality of dissection points at the main feature and further includes setting a target point at the main feature. The method includes arranging the two dissection points crossing the main feature symmetrically each other. The method includes separating two adjacent dissection points at one side of the main feature by a maximum resolution of the mask writer. The method includes dividing the main feature into a plurality of segments using the dissection points. The method includes performing an OPC convergence simulation to a target point. The method includes correcting the segments belonging to an ambit of the target point and further includes correcting the segment shared by two ambits.

    Abstract translation: 本公开描述了制备用于形成掩模的数据的OPC方法。 该方法包括在主要特征处设置多个解剖点，并且还包括在主要特征处设置目标点。 该方法包括将两个解剖点布置成彼此对称的主要特征。 该方法包括通过掩模写入器的最大分辨率在主要特征的一侧分离两个相邻的解剖点。 该方法包括使用解剖点将主要特征划分成多个段。 该方法包括对目标点执行OPC收敛模拟。 该方法包括校正属于目标点的范围的段，并且还包括校正由两个方位共享的段。

    NOVEL METHODOLOGY OF OPTICAL PROXIMITY CORRECTION OPTIMIZATION
    9.
    发明申请
    NOVEL METHODOLOGY OF OPTICAL PROXIMITY CORRECTION OPTIMIZATION 有权
    光临近度校正优化的新方法

    公开(公告)号：US20130275926A1

    公开(公告)日：2013-10-17

    申请号：US13448977

    申请日：2012-04-17

    Applicant: Hung-Chun Wang ,  Ming-Hui Chih ,  Yu-Po Tang ,  Chia-Ping Chiang ,  Feng-Ju Chang ,  Cheng Kun Tsai ,  Wen-Chun Huang ,  Ru-Gun Liu

    Inventor： Hung-Chun Wang ,  Ming-Hui Chih ,  Yu-Po Tang ,  Chia-Ping Chiang ,  Feng-Ju Chang ,  Cheng Kun Tsai ,  Wen-Chun Huang ,  Ru-Gun Liu

    IPC: G06F17/50

    CPC classification number: G06F17/5081 ,  G03F1/36 ,  G03F1/70

    Abstract: A method for performing OPC and evaluating OPC solutions is disclosed. An exemplary method includes receiving a design database corresponding to an IC circuit mask. A first lithography simulation and evaluation is performed on the design database utilizing a first set of performance indexes. A modification is made to the design database based on a result of performing the first lithography simulation and evaluation. A second lithography simulation and evaluation is performed on the design database utilizing a second set of performance indexes to verify the modification. If necessary, the design database is modified again based on a result of the second lithography simulation and evaluation. The modified design database is provided to a mask manufacturer for manufacturing the mask corresponding to the modified design database.

    Abstract translation: 公开了一种执行OPC和评估OPC解决方案的方法。 一种示例性方法包括接收对应于IC电路掩码的设计数据库。 使用第一组性能指标对设计数据库执行第一光刻模拟和评估。 基于执行第一光刻仿真和评估的结果对设计数据库进行修改。 使用第二组性能指标对设计数据库进行第二次光刻模拟和评估，以验证修改。 如果需要，基于第二光刻模拟和评估的结果再次修改设计数据库。 将修改后的设计数据库提供给掩模制造商以制造与修改的设计数据库相对应的掩模。

    OPTICAL PROXIMITY CORRECTION FOR MASK REPAIR
    10.
    发明申请
    OPTICAL PROXIMITY CORRECTION FOR MASK REPAIR 有权
    屏蔽修复光学近似校正

    公开(公告)号：US20130232454A1

    公开(公告)日：2013-09-05

    申请号：US13409515

    申请日：2012-03-01

    Applicant: Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

    Inventor： Chih-Shiang Chou ,  Ya-Ting Chang ,  Fu-Sheng Chu ,  Yu-Po Tang

    IPC: G06F17/50

    CPC classification number: G03F1/70 ,  G03F1/36

    Abstract: Integrated circuit (IC) methods for optical proximity correction (OPC) modeling and mask repair are described. The methods include use of an optical model that generates a simulated aerial image from an actual aerial image obtained in an optical microscope system. In the OPC modeling methods, OPC according to stage modeling is simulated, and OPC features may be added to a design layout according to the simulating OPC. In the mask repair methods, inverse image rendering is performed on the actual aerial image and diffraction image by applying an optical model that divides an incoherent exposure source into a plurality of coherent sources.

    Abstract translation: 描述了用于光学邻近校正（OPC）建模和掩模修复的集成电路（IC）方法。 这些方法包括使用从在光学显微镜系统中获得的实际空间图像生成模拟空间图像的光学模型。 在OPC建模方法中，根据阶段建模对OPC进行了仿真，根据模拟OPC可以将OPC特征加入到设计布局中。 在掩模修复方法中，通过应用将非相干曝光源分割为多个相干光源的光学模型，对实际的空间图像和衍射图像执行逆图像渲染。

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