发明申请
US20140027100A1 PIPING STRUCTURE OF COOLING DEVICE, METHOD FOR MAKING THE SAME, AND METHOD FOR CONNECTING PIPES
审中-公开
冷却装置的管道结构，其制造方法以及连接管道的方法
- 专利标题： PIPING STRUCTURE OF COOLING DEVICE, METHOD FOR MAKING THE SAME, AND METHOD FOR CONNECTING PIPES
- 专利标题（中）： 冷却装置的管道结构，其制造方法以及连接管道的方法
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申请号： US14110671申请日： 2012-04-10
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公开(公告)号： US20140027100A1公开(公告)日： 2014-01-30
- 发明人: Minoru Yoshikawa , Hitoshi Sakamoto , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
- 申请人： Minoru Yoshikawa , Hitoshi Sakamoto , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
- 申请人地址： JP Tokyo
- 专利权人： NEC CORPORATION
- 当前专利权人： NEC CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-089347 20110403
- 国际申请： PCT/JP2012/060197 WO 20120410
- 主分类号： F28F1/00
- IPC分类号： F28F1/00
摘要：
In a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility, therefore, a piping structure of a cooling device according to an exemplary aspect of the invention includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant.
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