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公开(公告)号：US20140144169A1
公开(公告)日：2014-05-29
申请号：US14131230
申请日：2012-07-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US09288931B2
公开(公告)日：2016-03-15
申请号：US14131230
申请日：2012-07-05
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US20130206368A1
公开(公告)日：2013-08-15
申请号：US13880252
申请日：2011-10-14
CPC分类号： F28D15/02 , B23P15/26 , F28D15/0266 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的凸起并且在内壁表面上形成气泡核，则冷却性能不利地降低，因此，根据本发明的示例性方面的冷却装置 包括存储制冷剂的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的蒸气状制冷剂的冷凝器; 以及连接蒸发器和冷凝器的连接件; 其中所述蒸发器包括与要冷却的物体热接触的基座和容器; 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起部; 并且气泡核形成表面仅包括在包括沸腾表面和突起的表面的制冷剂接触表面的一部分上。
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公开(公告)号：US20150034288A1
公开(公告)日：2015-02-05
申请号：US14349034
申请日：2012-09-26
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28D15/0233 , F28D2015/0216 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，当安装在电子设备中的布置的自由度增加时，冷却装置变大，并且不可能获得足够的布置自由度， 根据本发明的示例性方面的平板冷却装置包括：板状容器，包括第一平板和与第一平板相对的第二平板; 封闭在板状容器中的制冷剂; 以及引导壁单元，其将所述第一平板连接到所述第二平板并控制所述板状容器中的制冷剂的流动; 其特征在于，所述板状容器具有与设置在所述第一平板和所述第二平板中的至少一个上的加热元件热连接的热接收区域， 并且导向壁单元包括一对导向壁，并且引导壁设置在受热区域的相对侧上。
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公开(公告)号：US20130319639A1
公开(公告)日：2013-12-05
申请号：US14000681
申请日：2012-02-17
CPC分类号： F28D15/00 , B23P15/26 , F28D15/0266 , F28D15/0275 , F28F3/02 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，难以提高冷却性能而不增加制造成本，因此，根据本发明的示例性方面的冷却装置包括：储存制冷剂的热量接收单元， 待冷却物体; 散热单元，其通过冷凝和液化在所述受热单元中蒸发的制冷剂产生的蒸气状制冷剂来散热; 以及将热接收单元连接到散热单元的连接; 其中所述热接收单元包括与待冷却物体热接触的基座和连接到所述连接件的容器; 所述基座包括构成所述受热单元的外壁的一部分的受热单元外壁和在与所述制冷剂接触的内壁侧的下表面的受热单元下表面上的多个突起; 底座包括由热接收单元下表面和突起的表面构成的制冷剂接触表面上的气泡核形成表面; 并且所述受热单元包括在所述突起的顶部边缘和所述容器的面对所述受热单元下表面的内壁表面之一中包含蒸气状态的制冷剂的蒸汽状态的制冷剂区域。
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公开(公告)号：US09363886B2
公开(公告)日：2016-06-07
申请号：US14240348
申请日：2012-08-15
CPC分类号： H05K1/021 , F28D15/0266 , G06F1/20 , H05K7/2029
摘要： An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.
摘要翻译： 电子基板具有片状基材，其可以安装加热元件和冷却加热器元件的冷却结构。 电子基板可以在几乎平行于基材的表面的方向上被插入/插出。 冷却结构具有中空形状的第一散热部和传热部。 第一散热部照射安装在基材中的加热元件的发热。 传热部将所产生的热量传递到第一散热部。 第一散热部具有沿着与基材的插入和移除方向几乎垂直的面形成的第一接合面。 第一散热部分连接到第二辐射部分，该第二辐射部分在热穿过第一接合表面的情况下设置。
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公开(公告)号：US20140366572A1
公开(公告)日：2014-12-18
申请号：US14370185
申请日：2012-12-12
申请人： Arihiro MATSUNAGA , Minoru YOSHIKAWA , Hitoshi SAKAMOTO , Akira SHOUJIGUCHI , Masaki CHIBA , Kenichi INABA , NEC Corporation
发明人： Arihiro Matsunaga , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba
CPC分类号： F25B39/00 , F25B23/006 , F25B39/028 , F25B39/04 , F25B2339/02 , F25B2339/041 , F28D15/0266 , F28D2021/0028 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.
摘要翻译： [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。
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公开(公告)号：US20140190738A1
公开(公告)日：2014-07-10
申请号：US14240348
申请日：2012-08-15
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , F28D15/0266 , G06F1/20 , H05K7/2029
摘要： An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently.
摘要翻译： 电子基板100D具有片状基材110，其可以安装加热元件120和冷却加热器元件120的冷却结构。电子基板100可以在壳体200中沿几乎平行于 基体材料110的表面。冷却结构安装在片状基材110上，并具有中空形状的第一散热部160D和传热部700.具有中空形状的第一散热部160D辐射 安装在基材中的加热器元件120产生的热量。 传热部700将发热元件120的发热传递到第一散热部160D。 第一散热部分160D具有沿着基本材料110的插入和移除方向W几乎垂直的面形成的第一接合表面165.第一散热部分160D连接到设置在第一辐射部分260B中的第二辐射部分260B 壳体200热穿过第一接合表面165.结果，可以充分地辐射加热器元件的产生的热量。
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9.发明申请PIPING STRUCTURE OF COOLING DEVICE, METHOD FOR MAKING THE SAME, AND METHOD FOR CONNECTING PIPES 审中-公开冷却装置的管道结构，其制造方法以及连接管道的方法公开(公告)号：US20140027100A1
公开(公告)日：2014-01-30
申请号：US14110671
申请日：2012-04-10
IPC分类号： F28F1/00
CPC分类号： F28F1/00 , F28D15/0266 , F28F1/003 , F28F13/187 , F28F19/04 , F28F21/084 , F28F2255/02
摘要： In a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility, therefore, a piping structure of a cooling device according to an exemplary aspect of the invention includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant.
摘要翻译： 在使用沸腾冷却系统的冷却装置的配管结构中，如果管道具有柔性，则冷却装置的冷却性能下降，因此根据本发明的示例性方面的冷却装置的管道结构包括 第一管状部分，其具有中空部分，冷却装置中使用的制冷剂通过该中空部分流动; 其中所述第一管状部分由金属材料制成; 并且第一管状部的内表面的表面粗糙度小于或等于制冷剂的凝结核的尺寸。
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公开(公告)号：US20140165638A1
公开(公告)日：2014-06-19
申请号：US14235951
申请日：2012-07-20
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , F28D2021/0028 , H01L23/427 , H01L2224/16 , H05K7/20318
摘要： A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device.A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.
摘要翻译： 采用沸腾冷却方法的冷却装置安装在薄型电子装置中时不能表现出足够的冷却性能。 本发明的冷却装置包括：蒸发单元，其包含制冷剂;冷凝单元，其通过冷凝和液化在所述蒸发单元处蒸发的气相制冷剂进行散热;以及管道，其将所述蒸发单元与所述冷凝单元连接 ; 其中所述蒸发单元包括蒸发容器和分隔壁部分，所述分隔壁部分布置在所述蒸发容器内并构成所述制冷剂的流动路径，并且所述分隔壁部分的高度等于或大于所述气液体的高度 制冷剂的界面小于蒸发容器的高度。
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