发明申请
- 专利标题： SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
- 专利标题（中）： 带有元件的半导体器件封装
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申请号： US13681437申请日： 2012-11-20
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公开(公告)号： US20140027896A1公开(公告)日： 2014-01-30
- 发明人: Baoguan Yin , Junhua Luo , Deguo Sun
- 申请人： Baoguan Yin , Junhua Luo , Deguo Sun
- 优先权： CN201220524796.7 20120727
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L21/56
摘要：
A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.
公开/授权文献
- US08836105B2 Semiconductor device package with cap element 公开/授权日：2014-09-16
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