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    THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
    2.
    发明申请
    THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
    薄半导体封装及其制造方法

    公开(公告)号：US20110316130A1

    公开(公告)日：2011-12-29

    申请号：US13092159

    申请日：2011-04-22

    申请人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

    发明人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

    IPC分类号： H01L23/495 ,  H01L21/28

    CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

    摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

    摘要翻译： 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

    Thin semiconductor package and method for manufacturing same
    4.
    发明授权
    Thin semiconductor package and method for manufacturing same 有权
    薄半导体封装及其制造方法

    公开(公告)号：US08354739B2

    公开(公告)日：2013-01-15

    申请号：US13092159

    申请日：2011-04-22

    申请人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

    发明人： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

    IPC分类号： H01L23/495 ,  H01L21/28

    CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

    摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

    摘要翻译： 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

    Semiconductor device package with cap element
    5.
    发明授权
    Semiconductor device package with cap element 有权
    带帽元件的半导体器件封装

    公开(公告)号：US09093438B2

    公开(公告)日：2015-07-28

    申请号：US14459331

    申请日：2014-08-14

    申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/49 ,  H01L21/56 ,  H01L23/433 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31

    CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

    摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

    Semiconductor device package with cap element
    6.
    发明授权
    Semiconductor device package with cap element 有权
    带帽元件的半导体器件封装

    公开(公告)号：US08836105B2

    公开(公告)日：2014-09-16

    申请号：US13681437

    申请日：2012-11-20

    申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/49 ,  H01L23/495 ,  H01L23/433 ,  H01L23/31

    CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

    摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

    SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
    9.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT 有权
    带有元件的半导体器件封装

    公开(公告)号：US20140027896A1

    公开(公告)日：2014-01-30

    申请号：US13681437

    申请日：2012-11-20

    申请人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    发明人： Baoguan Yin ,  Junhua Luo ,  Deguo Sun

    IPC分类号： H01L23/49 ,  H01L21/56

    CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

    摘要翻译： 一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。 半导体管芯位于衬底元件上。 提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。 盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。 模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。