Invention Application
- Patent Title: ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 电极图案及其制造方法，使用电极图案的印刷电路板及其制造方法
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Application No.: US13956302Application Date: 2013-07-31
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Publication No.: US20140034358A1Publication Date: 2014-02-06
- Inventor: Kwang Jik Lee , Sang Hyun Shin , Hye Suk Shin , Joon Seok Kang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2012-0084842 20120802
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/02
Abstract:
Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same.
Information query
