Invention Application
- Patent Title: METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS
- Patent Title (中): 在金属层之间形成电气连接的方法
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Application No.: US13562534Application Date: 2012-07-31
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Publication No.: US20140038317A1Publication Date: 2014-02-06
- Inventor: Edward O. Travis , Douglas M. Reber , Mehul D. Shroff
- Applicant: Edward O. Travis , Douglas M. Reber , Mehul D. Shroff
- Main IPC: H01L21/768
- IPC: H01L21/768
Abstract:
A method forms an electrical connection between a first metal layer and a second metal layer. The second metal layer is above the first metal layer. A first via is formed between the first metal layer and the second metal layer. A first measure of a number of vacancies expected to reach the first via is obtained. A second via in at least one of the first metal layer and the second metal layer is formed if the measure of vacancies exceeds a first predetermined number.
Public/Granted literature
- US09032615B2 Method for forming an electrical connection between metal layers Public/Granted day:2015-05-19
Information query
IPC分类:
