发明申请
- 专利标题： METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS
- 专利标题（中）： 在金属层之间形成电气连接的方法
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申请号： US13562534申请日： 2012-07-31
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公开(公告)号： US20140038317A1公开(公告)日： 2014-02-06
- 发明人: Edward O. Travis , Douglas M. Reber , Mehul D. Shroff
- 申请人： Edward O. Travis , Douglas M. Reber , Mehul D. Shroff
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A method forms an electrical connection between a first metal layer and a second metal layer. The second metal layer is above the first metal layer. A first via is formed between the first metal layer and the second metal layer. A first measure of a number of vacancies expected to reach the first via is obtained. A second via in at least one of the first metal layer and the second metal layer is formed if the measure of vacancies exceeds a first predetermined number.