发明申请
US20140042298A1 CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming the Same
审中-公开
具有堆叠方案的CMOS图像传感器芯片及其形成方法
- 专利标题： CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming the Same
- 专利标题（中）： 具有堆叠方案的CMOS图像传感器芯片及其形成方法
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申请号： US13571099申请日： 2012-08-09
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公开(公告)号： US20140042298A1公开(公告)日： 2014-02-13
- 发明人: Meng-Hsun Wan , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu
- 申请人： Meng-Hsun Wan , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; H01L31/18 ; H01L27/148
摘要：
A device includes an image sensor chip having an image sensor therein. A read-out chip is underlying and bonded to the image sensor chip, wherein the read-out chip includes a logic device selected from the group consisting essentially of a reset transistor, a source follower, a row selector, and combinations thereof therein. The logic device and the image sensor are electrically coupled to each other, and are parts of a same pixel unit. A peripheral circuit chip is underlying and bonded to the read-out chip, wherein the peripheral circuit chip includes a logic circuit.