发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US13585500申请日： 2012-08-14
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公开(公告)号： US20140048926A1公开(公告)日： 2014-02-20
- 发明人: Tsung-Ding WANG , Jung Wei CHENG , Bo-I LEE
- 申请人： Tsung-Ding WANG , Jung Wei CHENG , Bo-I LEE
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/60
摘要：
A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.
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