Invention Application
- Patent Title: LIGHT-EMITTING-DEVICE PACKAGE AND A PRODUCTION METHOD THEREFOR
- Patent Title (中): 发光器件封装及其生产方法
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Application No.: US14114139Application Date: 2012-04-27
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Publication No.: US20140049153A1Publication Date: 2014-02-20
- Inventor: Chang Bun Yoon , Chul Soo Yoon , Ok Sik Han , Min Jung Park
- Applicant: Chang Bun Yoon , Chul Soo Yoon , Ok Sik Han , Min Jung Park
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Priority: KR10-2011-0039467 20110427
- International Application: PCT/KR2012/003302 WO 20120427
- Main IPC: H01L33/50
- IPC: H01L33/50

Abstract:
According to one embodiment of the present invention, a light-emitting-device package comprises a wavelength-converting layer which is formed on a light-emitting-device chip, comprises a fluorescent body and crystallized glass, and converts the wavelength of the light generated from the light-emitting-device chip. Consequently, by making the refractive indices of the phosphor and the crystallized glass comprised in the wavelength-converting layer coincide, it is possible to reduce the scattering losses which occur when the refractive indices differ. As a result, it is possible to improve the light-extraction efficiency of the light-emitting-device package. Also, because the to light-emitting-device package uses the wavelength-converting layer comprising the phosphor and the crystallized glass, the processability and reliability are outstanding and it is possible to reduce the processing time when the light-emitting-device package is produced.
Information query
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