Invention Application
US20140049920A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES 审中-公开
电子设备中的紧凑可组件组件组件

  • Patent Title: COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES
  • Patent Title (中): 电子设备中的紧凑可组件组件组件
  • Application No.: US14058360
    Application Date: 2013-10-21
  • Publication No.: US20140049920A1
    Publication Date: 2014-02-20
  • Inventor: Jason SloeyMichelle Yu
  • Applicant: Apple Inc.
  • Applicant Address: US CA Cupertino
  • Assignee: Apple Inc.
  • Current Assignee: Apple Inc.
  • Current Assignee Address: US CA Cupertino
  • Main IPC: H05K5/02
  • IPC: H05K5/02
COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES
Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
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