发明申请
- 专利标题： METHODS FOR PROMOTING WOUND HEALING
- 专利标题（中）： 促进伤口愈合的方法
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申请号： US13586439申请日： 2012-08-15
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公开(公告)号： US20140052216A1公开(公告)日： 2014-02-20
- 发明人: Gary L. Long , Gregory J. Bakos , David N. Plescia , Peter K. Shires
- 申请人： Gary L. Long , Gregory J. Bakos , David N. Plescia , Peter K. Shires
- 申请人地址： US OH Cincinnati
- 专利权人： Ethicon Endo-Surgery, Inc.
- 当前专利权人： Ethicon Endo-Surgery, Inc.
- 当前专利权人地址： US OH Cincinnati
- 主分类号： A61N1/00
- IPC分类号： A61N1/00
摘要：
A method for promoting wound healing at a wound site includes subjecting the wound site to electrical pulses to promote wound healing during at least one of the stages of wound healing. The method may further include closing the wound site by sutures or staples prior to and or after applying the electrical pulses that promote wound healing.
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